Reflow Ovens

Research International solder reflow ovens, explained

What reflow ovens did Research International make?

Research International designed and built forced-convection solder reflow ovens for surface-mount and printed-circuit-board assembly. The product line spanned several families: MicriFlo and ChipFlo for smaller boards and chip-scale work, DeltaFlo for large high-mass boards, ThermaFlo as a general production oven, the TOWER vertical system, and an earlier Clamshell line.

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What a reflow oven does in SMT assembly

A reflow oven is the machine that turns a placed circuit board into a soldered one. After solder paste is printed onto the pads and components are placed into that paste, the board travels through the oven on a conveyor and is heated through a controlled temperature profile: a gradual preheat, a soak that lets the whole board reach a common temperature, a short reflow spike above the solder's melting point, and then a cooldown that freezes every joint at once.

The entire reputation of an oven rests on how evenly and repeatably it can deliver that profile across a moving board. Get it right and every joint on a dense board forms cleanly in a single pass. Get it wrong and you see cold joints, tombstoned chips, lifted leads, or scorched laminate. Research International built its ovens around forced-convection heating, where heated gas is actively circulated rather than relying on radiant panels alone, because convection transfers heat more uniformly to the mix of large and small parts found on a real production board.

The oven families

MicriFlo and ChipFlo covered smaller boards and chip-scale package work, where tight thermal control on low-mass assemblies matters most. ThermaFlo served as a general-purpose production oven. DeltaFlo was the large-board specialist, built for high-volume assembly of boards with big components and significant mass differential, with extra heat zones and tight nitrogen control. The TOWER system took a vertical approach to save floor space, and an earlier Clamshell line preceded the inline tunnel ovens.

Across the line, the recurring engineering themes were the same: fan-forced convection for uniform heat transfer, multiple independently controlled heat zones so the profile could be shaped precisely, closed-loop nitrogen control to hold down oxidation and flux residue, and no-clean process zones designed to keep flux from building up inside the tunnel.

Why this reference exists

Equipment like this stays in service for decades. A reflow oven installed in the late 1990s or early 2000s can still be running a production line today, and the people maintaining it need the same information the original site once carried: which oven is which, what the families were designed for, where to find a datasheet, and how to source a replacement board or fan. The original Research International division's assets were acquired by another company in 2001, and the brand later moved on, so that reference material drifted off the live web.

This site rebuilds the useful core of that reference from the public record. It is independent and not affiliated with the original manufacturer or any later owner; product names appear only to identify the equipment. Start with the family you run, open its datasheet, then move to parts or field service.

What to look for

Key points

Resources

Datasheets, parts, and service

Each slot below is reserved for a vetted datasheet archive, parts supplier, or service partner. We are adding them as we verify them; nothing here is a paid placement, and this site does not sell ovens or parts directly.

Resource slot Datasheet library access

Link to the consolidated datasheet index for every oven family.

Resource slot Replacement parts sourcing partner

Reserved for a vetted supplier of reflow oven spares and boards.

Resource slot Independent service partner

Reserved for a field-service provider that supports legacy reflow ovens.

Questions

Frequently asked questions

What is a solder reflow oven used for?
It heats a populated circuit board through a controlled temperature profile so the printed solder paste melts and forms every joint at once, then cools so the joints solidify together. It is the soldering step of surface-mount assembly, after paste printing and component placement.
What is the difference between convection and infrared reflow?
Infrared ovens heat mainly by radiant panels, which can heat dark and light parts unevenly. Forced-convection ovens circulate heated gas so heat reaches large and small components more uniformly. Research International ovens were built around fan-forced convection for that reason.
Which Research International oven was for large boards?
DeltaFlo was the large-board specialist, designed for high-volume assembly of boards with big components and significant mass differential, with additional heat zones and closed-loop nitrogen control to hold a narrow temperature spread across a large board.
Is Research International still in business?
The assets of the original Research International division that made these reflow ovens were acquired by another company in 2001. This site is an independent reference and is not affiliated with the original manufacturer or any later owner.
Why does nitrogen matter in a reflow oven?
Running the reflow zone under nitrogen lowers the oxygen level, which reduces oxidation of the solder and the pads during melting. That improves wetting and reduces flux residue, which is especially useful for fine-pitch and no-clean processes.

Research International is an independent reference site and is not affiliated with, endorsed by, or the successor to the original equipment manufacturer or any company that later acquired its assets. Trademarks and product names belong to their respective owners and are used here only to identify the equipment described. Some outbound links may be affiliate or partner links, at no extra cost to you.